? 1 ? CXG1172UR 12 pin uqfn (plastic) jphemt high power dpdt switch with logic control description the CXG1172UR can be used in wireless com- munication systems, for example, cdma handsets, w-cdma handsets. the ic has on-chip logic for operation with 1 cmos control input. the sony jphemt process is used for low insertion loss and on-chip logic circuit. features ? low insertion loss: 0.3db@900mhz, 0.45db@2ghz 1 cmos compatible control line small package size: 12-pin uqfn applications antenna switch for cellular handsets w-cdma, cdma structure gaas jphemt mmic absolute maximum ratings (ta = 25c) bias voltage v dd 7v control voltage vctl 5 v operating temperature topr ?35 to +85 c storage temperature tstg ?65 to +150 c gaas mmics are esd sensitive devices. special handling precautions are required. e04522-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits.
? 2 ? CXG1172UR block diagram and recommended circuit when using this ic, the following external components should be used. rctl: this resistor is used to improve esd performance. 1k ? is recommended. c rf : this capacitor is used for rf decoupling and must be used for all applications. cbypass: this capacitor is used for dc line filtering. 100pf is recommended. truth table ctl l h on state rf1 ? rf2, rf3 ? rf4 rf2 ? rf3, rf4 ? rf1 f1 on off f2 off on f3 on off f4 off on rctl (1k ? ) cbypass (100pf) cbypass (100pf) c rf c rf rf1 gnd ctl gnd v dd gnd rf4 gnd gnd 10 9 7 1 3 11 12 f3 f1 f2 f4 gnd rf2 c rf rf3 c rf 8 2 6 5 4 off state rf2 ? rf3, rf4 ? rf1 rf1 ? rf2, rf3 ? rf4
? 3 ? CXG1172UR dc bias condition (ta = 25c) item vctl (h) vctl (l) v dd unit v v v min. 2.0 0 2.5 ty p. 2.85 ? 2.85 max. 3.6 0.4 3.6 electrical characteristics (ta = 25c) item insertion loss isolation vswr switching speed 1db compression input power input ip3 aclr harmonics bias current control current condition 900mhz 1500mhz 2000mhz 900mhz 1500mhz 2000mhz 50 ? ? 1 , ? 2 ? 3 ? 1 , 5mhz ? 1 , 10mhz ? 1 ? 1 ? 2 ? 2 v dd = 2.85v vctl (h) = 2.85v symbol il iso. vswr tsw p1db iip3 aclr1 aclr2 2fo 3fo 2fo 3fo i dd ictl unit db db db db db db ? s dbm dbm dbc dbc dbc dbc dbc dbc a a ty p. 0.30 0.35 0.45 22 18 16 1.2 8 60 ?60 ?60 ?75 ?75 ?75 ?75 25 15 max. 0.50 0.55 0.65 1.5 ?50 ?55 ?55 ?55 ?60 ?60 50 25 min. 14 10 8 33 50 ? 1 pin = 25dbm, 0/2.85v control, v dd = 2.85v, 1920 to 1980mhz ? 2 pin = 25dbm, 0/2.85v control, v dd = 2.85v, 900mhz ? 3 pin = 25dbm (900mhz) + 25dbm (901mhz), 0/2.85v control, v dd = 2.85v
? 4 ? CXG1172UR pin description pin no. 2 4 6 8 10 12 1, 3, 5, 7, 9, 11 description rf input/output. connect capacitor (recommended value: 100pf) in use rf input/output. connect capacitor (recommended value: 100pf) in use rf input/output. connect capacitor (recommended value: 100pf) in use rf input/output. connect capacitor (recommended value: 100pf) in use dc power supply logic control gnd symbol rf1 rf2 rf3 rf4 v dd ctl gnd
? 5 ? CXG1172UR sony corporation package outline unit: mm pin 1 index c 0.1 s a-b 0.4 0.05 m s c c a-b s 0.05 s max0.02 + 0.09 12pin uqfn (plastic) 0.25 ? 0.03 + 0.09 0.14 ? 0.03 x 4 2.0 4 1 3 9 7 6 12 10 2.0 s 0.4 0.1 0.6 0.55 0.05 4-r0.2 0.26 a b 0.25 0.14 0.07 0.18 sony code eiaj code jedec code package material lead treatment lead material epoxy resin solder plating copper alloy 0.01g package structure uqfn-12p-01 package mass terminal section note:cutting burr of lead are 0.05mm max. solder plating lead plating specifications item lead material copper alloy solder composition sn-bi bi:1-4wt% plating thickness 5-18 m spec.
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